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A paper from UC Berkeley and FuriosaAI examines the use of High Bandwidth Flash to expand the memory of AI accelerators when running large language models. The simulations indicate a reduction in completion time of up to 87%, with potential improvements in energy consumption and write endurance through cache-aware scheduling.
Production capacity for substrates is no longer sufficient to meet advanced packaging needs; package size, layer count, interconnect precision, and integrated functions make each design increasingly similar to a specialized manufacturing process. This affects materials, equipment, qualification, and supply sources, particularly in artificial intelligence, high-performance computing, integrated optics, and automotive packages.