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During HUAWEI CONNECT 2026, Huawei presented its vision for building AI infrastructure based on SuperPoDs and SuperClusters, noting that a simulation of a group comprising 100,000 NPUs achieved 2.75 times higher utilization efficiency compared with a traditional server architecture. It also announced the deployment of more than 1,000 Atlas 900 A3 SuperPoD systems.
Huawei announced new Ascend chips and Atlas SuperPoD systems designed to train and run artificial intelligence models, with launch dates spanning 2027 to 2029. The plan includes an optical interconnect architecture, while the company says its new architecture could deliver performance equivalent to 1.4-nanometer chips by 2031 without relying on comparable process-node shrinkage.