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Intel Foundry uses Foveros, EMIB, and EMIB-T technologies to connect small, specialized chiplets within larger packages, aiming to overcome photomask size limits and improve the performance and efficiency of artificial intelligence systems. The company says its facilities in New Mexico enable packages to be expanded to eight times the current industry standard, and to more than 12 times that standard by 2028.
Intel announced a €5 billion capital investment at its Leixlip campus in Ireland to increase manufacturing capacity and modernize production facilities in support of Xeon 6 processors and the next generation of Xeon processors manufactured using Intel 3. The project is expected to create permanent technical jobs and engage specialized workers in construction and equipment installation.