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An analysis published in Semiconductor Engineering argues that the future of semiconductor manufacturing will depend not only on shrinking components, but also on developing new materials through simulation, artificial intelligence, and early collaboration among chip manufacturers, equipment suppliers, and materials suppliers. The analysis presents examples including dry manufacturing processes, photonic interconnects, and gallium nitride substrates.
The semiconductor packaging industry is exploring negative thermal expansion materials that can reduce mismatches between the expansion of the die, substrate, and surrounding mold compound, a problem that is worsening as package and panel sizes increase. However, widespread adoption of these materials still depends on their ability to operate across a broad temperature range, mix homogeneously, and control impurities.