Chips and Semiconductors

Processors, GPU units, on-device artificial intelligence, chip manufacturing, and industry news.

8 Articles

Key Developments in the Chip Industry: Expansions in Advanced Packaging and Shifts in Data Center Architecture

Semiconductor Engineering tracked major expansions in packaging and testing capacity, architectural shifts in artificial intelligence data centers, and developments in memory, quantum computing, hardware security, and autonomous vehicles over a single week. Key moves included ASE’s investment of approximately $3.1 billion, Lam Research’s $3 billion plan, and initiatives to standardize optical architectures and power sources for data centers.

2026-08-14

Chips and Semiconductors

Vertical Integration Takes Hold in System and Chip Design

A Semiconductor Engineering analysis argues that the traditional separation between hardware and software teams is no longer suitable for modern systems, particularly as AI workloads accelerate and power and thermal constraints intensify. This is driving companies to design more specialized hardware in parallel with software, while challenges involving tools, cost and standardization remain.

2026-08-13

Chips and Semiconductors

Why NPUs Need Redesigning as Edge AI Shifts to LLMs

Sharad Chol of Expedera analyzes how the transition of edge devices from traditional vision networks to LLM and VLM models is shifting the nature of the bottleneck from computational capacity to memory traffic. He outlines the role of packet-based processing in reducing external data transfers and improving model execution inside vehicles and embedded devices.

2026-08-13

Chips and Semiconductors

Synopsys Develops 112-Gigabit PHY for Linear Optical Links in AI Systems

Synopsys says the new PHY, compatible with the OIF-CEI-112G-LINEAR-PAM4 specification, enables signal processing to be moved to the host SerDes, potentially reducing power consumption, latency, and heat in high-speed optical links. The solution targets AI and hyperscale data center architectures as the industry moves toward 224 gigabits per lane and beyond.

2026-08-13

Chips and Semiconductors

Intel Launches SEPP Program to Expand Education Pathways to Semiconductor Jobs in Four U.S. States

Intel launched its company-funded Semiconductor Education Pathways Program (SEPP) to support educational and career pathways extending from K–12 education to universities, community colleges, and jobs in the semiconductor sector. The program focuses on Arizona, New Mexico, Ohio, and Oregon by funding students, educators, institutions, and community partners.

2026-08-06

Chips and Semiconductors

Intel Expands Advanced Packaging Capabilities in the United States to Support Artificial Intelligence Semiconductors

Intel Foundry uses Foveros, EMIB, and EMIB-T technologies to connect small, specialized chiplets within larger packages, aiming to overcome photomask size limits and improve the performance and efficiency of artificial intelligence systems. The company says its facilities in New Mexico enable packages to be expanded to eight times the current industry standard, and to more than 12 times that standard by 2028.

2026-07-29

Chips and Semiconductors

Intel Announces Completion of the RAMP-C Program and Paves the Way for High-Volume Manufacturing of Trusted Chips

Intel Foundry has completed the RAMP-C program, which supported the development of advanced domestic CMOS technology in the United States and reached validated prototypes and manufacturing readiness across the partner ecosystem. The company says the results prepare its customers to benefit from the Secure Enclave program for large-scale production of secure semiconductors using Intel 18A technology.

2026-07-28

Chips and Semiconductors

Intel Invests €5 Billion to Expand Chip Manufacturing in Ireland

Intel announced a €5 billion capital investment at its Leixlip campus in Ireland to increase manufacturing capacity and modernize production facilities in support of Xeon 6 processors and the next generation of Xeon processors manufactured using Intel 3. The project is expected to create permanent technical jobs and engage specialized workers in construction and equipment installation.

2026-07-13