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Co-Packaged Optics

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Chip Industry Week: Design Agents, HBM Memory, Photonics, and Energy and Security Pressures

Chip Industry Week: Design Agents, HBM Memory, Photonics, and Energy and Security Pressures

Semiconductor Engineering reviewed several major developments in the chip industry, from artificial intelligence agents for chip design and Spectre-v2 threats to the expansion of advanced packaging and photonics and the shortage of engineers. The overall picture reveals that the growth of AI infrastructure is simultaneously placing pressure on memory, energy, networking, and manufacturing capacity.

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Morphotonics Raises €40 Million to Expand Smart-Glasses and Data-Center Optics Manufacturing Technologies

Morphotonics Raises €40 Million to Expand Smart-Glasses and Data-Center Optics Manufacturing Technologies

Dutch company Morphotonics has raised €40 million to expand production of nanoimprint equipment used in smart-glasses displays and enter the co-packaged optics market for data-center devices.

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日本ガイシ Presents Ceramic Solutions for Dissipating Heat from AI Chips and Improving CPO Signals

日本ガイシ Presents Ceramic Solutions for Dissipating Heat from AI Chips and Improving CPO Signals

日本ガイシ presented ceramic technologies targeting cooling and signal-loss challenges in semiconductor packages used with AI workloads, including an aluminum nitride substrate for 300 mm sizes and a packaging architecture for co-packaged optics (CPO) applications.