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Semiconductor Engineering reviewed several major developments in the chip industry, from artificial intelligence agents for chip design and Spectre-v2 threats to the expansion of advanced packaging and photonics and the shortage of engineers. The overall picture reveals that the growth of AI infrastructure is simultaneously placing pressure on memory, energy, networking, and manufacturing capacity.
Nexstrom has raised a $12 million seed funding round to develop equipment that grows 2D semiconductor materials directly on 300 mm wafers. The company aims to help chip fabs produce TMD materials in commercial quantities, but does not expect its equipment to be ready for commercial production before the period between 2030 and 2035.