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The shift of AI chips toward stacked architectures and chiplet-based designs is forcing EDA tools to analyze the entire system, from the chip to the package and board, while integrating agentic AI to accelerate exploration. However, interoperability, dynamic planning, power and thermal analysis, and maintaining result accuracy remain key challenges.
It is not enough for a digital twin to emulate the theoretical design of a package; it must remain synchronized with what production lines actually manufacture, while linking chip, material, supplier, and test data. The article reveals that insufficient context, overlapping physical effects, and the need for continuous calibration are the main obstacles to building a digital twin for advanced chip packages.