Follow the latest coverage, related explainers and connected technology stories.
Semiconductor Engineering reviewed a selection of major developments in the chip industry, from the TSMC–GlobalFoundries agreement to manufacture CoWoS packaging components, to research into Hyper-NA EUV and major investments in AI chips, power, and data centers. The developments show that the bottleneck is gradually shifting from processor manufacturing to packaging, power, optical interconnects, and supply chain security.
The semiconductor industry is preparing to transition to three-dimensional CFET transistors, which place nFET and pFET transistors on top of one another to increase density and performance. However, their success will depend on interconnect precision, defect control, and warpage. Intel, TSMC, Samsung, and IBM are pursuing different manufacturing approaches, with growing reliance on multiphysics simulation and virtual manufacturing.