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A Semiconductor Engineering report reviews seven research papers covering the growth of two-dimensional semiconductors, ultrathin gate dielectrics, high-numerical-aperture EUV lithography, protection of AI accelerators from bit-flip attacks, and memory interfaces and integrated photonics.
Recent research from universities in Singapore, Japan, and South Korea examines three chip technologies: an ultrathin carbon layer for insulating copper interconnects, SiC transistors operating at more than 600 degrees Celsius, and an insulating structure that improves the reliability of vertical-channel transistors used in in-memory computing.