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The transition to sub-2-nanometer manufacturing nodes is merging the roles of testing, measurement, inspection, and manufacturing, as chips become more sensitive to variations and defects. Analysis by Semiconductor Engineering indicates that managing data throughout the chip life cycle, from design to operation, has become essential for maintaining yield and reliability.
Semiconductor Engineering reviews a group of trends affecting chip design and advanced architectures, including the evolution of architectures, the use of artificial intelligence in 3D-IC design, the growth of India’s semiconductor sector, and the trajectory of 6G technologies.
Integrating photonic dies near processors promises to reduce energy consumption and increase bandwidth, but it turns chiplet design into a collaboration between the thermal, mechanical, electromagnetic, and optical domains. Therefore, selecting the location of the photonic die is no longer a separate decision, but part of the complete system design and verification process.